到 2034 年，数字增材制造将推动柔性混合电子元件市场达到 14 亿美元。
柔性混合电子元件 2024 - 2034
涵盖可穿戴电子设备、原型汽车电子产品和智能包装等应用，以及导电油墨、柔性集成电路、组件附着材料/方法和 R2R 制造等基础技术。
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《柔性混合电子元件 2024 - 2034》评估该新兴制造方法的现状和前景，该方法旨在将印刷电子和传统电子的优势结合起来。柔性混合电子元件 (FHE) 通常被描述为“印刷你能做到的，安置你无法做到的”，它有数字增材电子制造的优势，而不会影响集成电路的处理能力。根据多年来对印刷电子行业的跟踪和 40 次访谈，本报告概述了生产 FHE 电路所需的材料、组件和制造方法的趋势和创新。
'Flexible Hybrid Electronics 2024-2034' evaluates the status and prospects of this emerging manufacturing methodology, which aims to combine the best aspects of printed and conventional electronics. Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) brings the benefits of digital additive electronics manufacturing without compromising on the processing capabilities of integrated circuits. Drawing on years of following the printed electronics industry and 40 interviews, the report outlines trends and innovations in the materials, components, and manufacturing methods required to produce FHE circuits.
Furthermore, the report explores the application sectors where FHE is most likely to be adopted, drawing on both current activity and an evaluation of FHE's value proposition. Granular market forecasts break down the opportunities for FHE circuits across 5 application sectors (automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial) into 39 specific opportunities such as skin temperature sensors and printed RFID tags.
Inputs, assembly, and applications for FHE circuits. Source IDTechEx
IDTechEx analyses and concludes in this report how the global demand for flexible hybrid electronic circuits will reach a value of around US$1.8 billion by 2034 - more if the infrastructure, software and services are included. Our detailed and highly granular market forecasts take account of projected demand for a wide range of applications, along with the technological readiness level of the required components.
Defining flexible hybrid electronics
We define FHE as a circuit that comprises a flexible substrate, printed functionality (typically the conductive interconnects) and mounted components (typically an externally manufactured integrated circuit (IC)). Other functionalities such as sensors, batteries and energy harvesting capabilities may be either printed or mounted.
Assessing product-market fit
With so many potential addressable markets, establishing where FHE offers the most compelling value proposition relative to alternative electronics manufacturing approaches is essential. As a manufacturing methodology rather than a specific product, the benefits of using FHE are highly dependent on the application.
For prototyping and high mix volume production, printing with digital methods such as inkjet rather than chemically etching the conductive traces enables straightforward adjustments to design parameters. This brings multiple benefits, including shortening the product development process by reducing the time between design iterations, and facilitating product 'versioning' to meet specific customer requirements without substantially increasing production costs.
Alternatively, for very high-volume applications such as RFID tags, smart packaging and even large area lighting, the compatibility of FHE with high throughput roll-to-roll (R2R) manufacturing via rotary printing methods such as flexography and gravure offers the potential for reduced costs. Rapid production can be expedited by low temperature and/or high-speed component attachment methods, with competing approaches analyzed in detail within the report. The benefits of R2R manufacturing are especially pronounced if variable costs can be reduced, for example by utilizing cheaper copper-based conductive inks and printing directly onto existing packaging rather than separate substrates.
Flexibility and stretchability of course also form part of FHE's value proposition. While conventionally manufactured flexible PCBs already meet some application requirements, such as for making electrical connections in confined spaces, the resilience of many printed conductive inks to repeated bending and tighter curvatures offers a clear differentiator. FHE is thus well suited for wearable applications such as electronic skin patches, and for applications where the conformality enabled by stretchability such as integrated lighting.
Enabling technologies
Manufacturing FHE circuits requires many current and developing emerging technologies which are essential to circuits. These include:
- Low cost thermally stabilised PET substrates that are dimensionally stable.
- Component attachment materials compatible with flexible thermally fragile substrates, such as low temperature solder and field aligned anisotropic conductive adhesives.
- Flexible integrated circuits, based on both thinned Si and metal oxides.
- Conductive inks, based on both silver and copper.
- Thin film batteries, especially if printable.
- Printed sensors of all types.
- Manufacturing methods for mounting components on flexible substrates.
The status and prospects of each technology is assessed in detail, with recent developments and technological gaps highlighted, and the merits of different approaches compared. This analysis is based on interviews with many of the suppliers, and annual attendance at multiple printed/flexible electronics conferences. Furthermore, we profile 6 government research centres and a range of collaborative projects from around the world that support the adoption of flexible hybrid electronics, demonstrating the major players and technological themes.
Outlook
The growth in printed/flexible/hybrid electronics, especially where it enables new applications and even business models such as electronic skin patches for remote health monitoring and smart packaging, will drive the growth of the conductive ink market over the next decade. Furthermore, many emerging applications, such is in-mold electronics, e-textiles and high-frequency antennas, have specific ink requirements that provides an opportunity for differentiation.
Key questions answered in this report
- What is the current status of FHE in different applications?
- What are the recent innovations and developments in the FHE space?
- In which applications does FHE represent the most compelling value proposition?
- What is the forecast market opportunity by application and for materials/components?
- What are the enabling technologies for FHE, and what are the remaining technological gaps?
- Which companies and government funded organizations are currently involved in FHE?
IDTechEx has 20 years of expertise covering printed and flexible electronics, including conductive inks. Our analysts have closely followed the latest developments in the technology and associated markets by interviewing many conductive ink suppliers and users and annually attending multiple printed electronics conferences such as LOPEC and FLEX. This report provides a complete picture of the fragmented conductive ink landscape, helping to inform product development and positioning.
This report provides market intelligence about the emerging manufacturing methodology of flexible hybrid electronics (FHE), including constituent technologies and use cases. This includes:
Key aspects
A review of the context and technology behind flexible hybrid electronics
- Motivation for adopting FHE
- Assessment of how FHE compares with competing technologies, and where it offers the most substantial value proposition.
- Technical details and examples of 8 constituent technologies, including flexible ICs and low-temperature component attachment methods.
Assessment of the current status of FHE across multiple use cases
- Review of recent developments within FHE, including highlights from recent conferences.
- Details of government research centers activities.
- Examples of how FHE is deployed for each of 6 use cases.
Market analysis throughout
- Reviews of electronic skin patch players throughout each key sector, analyzed from over 130 companies
- Historic electronic skin patch market data from 2010-2022 for 11 sectors
- Market forecasts from 2023-2034 for 13 sectors, including full narrative, limitations, and methodologies for each
| Report Metrics | Details |
|---|---|
| Historic Data | 2021 - 2022 |
| Forecast Period | 2023 - 2034 |
| Forecast Units | Circuit area (sqm), Revenue (US$ millions) |
| Regions Covered | Worldwide |
| Segments Covered | Automotive (sensing, heating, lighting, other circuitry), consumer (smart packaging, HMI sensing, lighting, e-textiles), energy (flexible PV for indoor energy harvesting), healthcare (skin patches, e-textiles, smart packaging, medical devices, wearable sensors), infrastructure/buildings/industrial (sensing, lighting, reconfigurable intelligent surfaces). |
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如果您对这一报告有任何疑问，请随时联系我们的报告团队 research@IDTechEx.com 或致电我们的销售经理：
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| 1. | EXECUTIVE SUMMARY |
| 1.1. | Flexible hybrid electronics: Analyst viewpoint (I) |
| 1.2. | Analyst viewpoint (II) |
| 1.3. | What is flexible hybrid electronics (FHE)? |
| 1.4. | Motivating factors for FHE |
| 1.5. | Comparing benefits of conventional and flexible hybrid electronics |
| 1.6. | Overcoming the flexibility/functionality compromise |
| 1.7. | Predicted manufacturing trends for FHE |
| 1.8. | Supplier opportunities created by FHE adoption |
| 1.9. | Non-technological barriers to FHE adoption |
| 1.10. | Where does FHE have a sufficient value proposition? |
| 1.11. | FHE value proposition for different applications |
| 1.12. | Technology gaps and potential solutions for FHE to meet application requirements |
| 1.13. | Materials, components, and manufacturing methods for FHE |
| 1.14. | Component attachment materials for FHE: Conclusions |
| 1.15. | Flexible ICs: Conclusions |
| 1.16. | Flexible batteries for FHE: Conclusions |
| 1.17. | Energy harvesting for FHE: Conclusions |
| 1.18. | Flexible substrates for FHE: Conclusions |
| 1.19. | Conductive inks for FHE: Conclusions |
| 1.20. | R2R manufacturing for FHE: Conclusions |
| 1.21. | Use cases for FHE |
| 1.22. | FHE for electronic skin patches: Conclusions |
| 1.23. | FHE for e-textiles: Conclusions |
| 1.24. | FHE for smart packaging: Conclusions |
| 1.25. | FHE for IoT devices (industrial and domestic): Conclusions |
| 1.26. | FHE for large area LED lighting: Conclusions |
| 1.27. | Additive circuit prototyping with FHE: Conclusions |
| 1.28. | FHE circuit area forecast by application sector |
| 1.29. | FHE revenue forecast by application sector |
| 2. | INTRODUCTION |
| 2.1. | Overview |
| 2.1.1. | FHE combines the benefits of conventional and purely printed electronics |
| 2.1.2. | What counts as FHE? |
| 2.1.3. | Commonality with other established and emerging electronics methodologies |
| 2.1.4. | Printed electronics is additive, but can be analogue or digital |
| 2.1.5. | Multilayer PCBs - technically challenging for FHE |
| 2.1.6. | Overcoming the flexibility/functionality compromise |
| 2.1.7. | Readiness of FHE for different application sectors |
| 2.1.8. | FHE value chain: Many materials and technologies |
| 2.1.9. | Benefits of printing conductive interconnects |
| 2.1.10. | SWOT analysis: Flexible hybrid electronics (FHE) |
| 2.1.11. | Ensuring reliability of printed/flexible electronics is crucial |
| 2.1.12. | Digitization in manufacturing facilitates 'FHE-as-a-service' |
| 2.1.13. | Alternative routes to FHE manufacturing |
| 2.1.14. | Standards for FHE |
| 2.2. | Recent FHE developments |
| 2.2.1. | VTT improves FHE pilot line capabilities (I) |
| 2.2.2. | FHE manufacturing of capacitive touch interfaces and flexible lighting. |
| 2.2.3. | VTT improves FHE pilot line capabilities (II) |
| 2.2.4. | Emergence of contract manufacturer TracXon for flexible hybrid electronics (FHE) |
| 2.2.5. | CPI focuses on printed/hybrid electronics for healthcare applications |
| 2.2.6. | Jabil develops FHE prototypes for healthcare applications |
| 2.2.7. | Growing interest in utilizing copper ink for FHE (I) |
| 2.2.8. | Growing interest in utilizing copper ink for FHE (II) |
| 2.3. | Government funded projects and research centers |
| 2.3.1. | Government funded projects dominate |
| 2.3.2. | NextFlex focus on prototype system development |
| 2.3.3. | Funding of Nextflex project calls |
| 2.3.4. | Holst Centre develops |
| 2.3.5. | IMEC collaborates with Pragmatic to develop an 8-bit flexible microprocessor |
| 2.3.6. | Liten CEA-Tech develops printed batteries and transistors |
| 2.3.7. | Korea Institute of Machinery and Materials develops R2R transfer method |
| 2.3.8. | EU Smart2Go project aims to integrate energy harvesting into wearable devices |
| 2.3.9. | Swedish research center RISE offers hybrid electronics prototyping |
| 2.3.10. | ITRI develops armband for contactless EMG detection |
| 2.3.11. | Recent US government funded FHE projects: 2022 |
| 2.3.12. | Recent US government funded FHE projects: 2021 |
| 3. | MARKET FORECASTS |
| 3.1. | Overview |
| 3.1.1. | Market forecasting methodology: Applications |
| 3.1.2. | Market forecasting methodology: FHE proportion |
| 3.1.3. | FHE circuit area forecast by application sector |
| 3.1.4. | FHE circuit area forecast by application sector (2023, 2028, 2033) |
| 3.1.5. | FHE revenue forecast by application sector |
| 3.1.6. | FHE revenue forecast by application sector (2023, 2028, 2033) |
| 3.1.7. | FHE circuit area forecast for automotive applications |
| 3.2. | Forecasts by application sector |
| 3.2.1. | FHE revenue forecast for automotive applications |
| 3.2.2. | FHE circuit area forecast for consumer applications |
| 3.2.3. | FHE revenue forecast for consumer applications |
| 3.2.4. | FHE circuit area forecast for energy applications |
| 3.2.5. | FHE revenue forecast for energy applications |
| 3.2.6. | FHE circuit area forecast for healthcare/wellness applications |
| 3.2.7. | FHE revenue forecast for healthcare/wellness applications |
| 3.2.8. | FHE circuit area forecast for infrastructure / buildings / industrial applications |
| 3.2.9. | FHE revenue forecast for infrastructure / buildings / industrial applications |
| 4. | MATERIALS, COMPONENTS AND MANUFACTURING METHODS |
| 4.1. | Overview |
| 4.1.1. | Materials, components, and manufacturing methods for FHE |
| 4.2. | Component attachment methods and materials |
| 4.2.1. | Component attachment material: Introduction |
| 4.2.2. | Differentiating factors amongst component attachment materials |
| 4.2.3. | Low temperature solder enables thermally fragile substrates |
| 4.2.4. | Low temperature solder alloys |
| 4.2.5. | Comparing electrical component attachment materials |
| 4.2.6. | Photonic soldering gains traction |
| 4.2.7. | Component attachment materials (for printed/flexible electronics): SWOT analysis |
| 4.2.8. | Low temperature full metal interconnects with liquid metal solder microcapsules |
| 4.2.9. | Solder facilitates rapid component assembly via self- alignment |
| 4.2.10. | Electrically conductive adhesives: Dominant approach for flexible hybrid electronics |
| 4.2.11. | Example of conductive adhesives on flexible substrates |
| 4.2.12. | Durable and efficient component attachment is important for FHE circuit development |
| 4.2.13. | Field-aligned anisotropic conductive adhesive reaches commercialization |
| 4.2.14. | Conductive paste bumping on flexible substrates |
| 4.2.15. | Component attachment materials for FHE roadmap |
| 4.2.16. | Component attachment materials: Readiness level |
| 4.2.17. | Component attachment materials for FHE: Conclusions |
| 4.3. | Flexible ICs |
| 4.3.1. | Flexible ICs: Introduction |
| 4.3.2. | Fully printed ICs have struggled to compete with silicon |
| 4.3.3. | Current approaches to printed logic |
| 4.3.4. | Fully printed ICs for RFID using CNTs emphasize design flexibility |
| 4.3.5. | Metal oxide semiconductors: An alternative to organic semiconductors |
| 4.3.6. | Benefits |
| 4.3.7. | Investment into metal oxide ICs continues |
| 4.3.8. | Larger flexible ICs can reduce attachment costs |
| 4.3.9. | Flexible metal oxide ICs target applications beyond RFID such as smart packaging |
| 4.3.10. | Thinning silicon wafers for flexibility without compromising performance |
| 4.3.11. | Manufacturing flexible 'silicon on polymer' ICs |
| 4.3.12. | Embedding thinned silicon ICs in polymer |
| 4.3.13. | Embedding both thinned ICs and redistribution layer in flexible substrate |
| 4.3.14. | Silicon thinning process would need to be inserted into existing value chain |
| 4.3.15. | Where will bespoke or natively flexible processes be required? |
| 4.3.16. | Comparing flexible integrated circuit technologies |
| 4.3.17. | Flexible ICs: SWOT analysis |
| 4.3.18. | Roadmap for flexible ICs technology adoption |
| 4.3.19. | Flexible ICs: Conclusions |
| 4.4. | Printed and mounted sensors |
| 4.4.1. | Printable sensing materials: Introduction |
| 4.4.2. | What defines a printed sensor? |
| 4.4.3. | Overview of specific printed/flexible sensor types |
| 4.4.4. | Drivers for printed/flexible sensors |
| 4.4.5. | FHE enables IoT monitoring and 'ambient computing' |
| 4.4.6. | Screen printing dominates printed sensor manufacturing |
| 4.4.7. | Polymeric piezoelectric materials receive increasing interest |
| 4.4.8. | Sensing for industrial IoT |
| 4.4.9. | Sensing for wearables/AR |
| 4.4.10. | Companies looking to incorporate printed/ flexible sensors often require a complete solution |
| 4.4.11. | Printable temperature sensors |
| 4.4.12. | MEMS for flexible hybrid electronics |
| 4.4.13. | Printable sensor materials: SWOT analysis |
| 4.4.14. | Printed sensor materials: Readiness level assessment |
| 4.4.15. | Printed sensors for FHE: Conclusions |
| 4.5. | Thin film batteries |
| 4.5.1. | Thin film batteries and power sources |
| 4.5.2. | 'Thin', 'flexible' and 'printed' are separate properties |
| 4.5.3. | Major battery company targets printed/flexible batteries for smart packaging |
| 4.5.4. | Printed flexible batteries in development for smart packaging |
| 4.5.5. | Printed and coin cell battery integration for FHE smart tags |
| 4.5.6. | Using a thin film battery as an FHE substrate |
| 4.5.7. | FHE as a power conditioning circuit |
| 4.5.8. | Technology benchmarking for printed/flexible batteries |
| 4.5.9. | Flexible batteries: SWOT analysis |
| 4.5.10. | Application roadmap for printed/flexible batteries |
| 4.5.11. | Flexible batteries for FHE: Conclusions |
| 4.6. | Energy harvesting for FHE |
| 4.6.1. | Energy harvesting for FHE: Introduction |
| 4.6.2. | Epishine is leading the way in solar powered IoT, but no attempt to integrate with FHE yet |
| 4.6.3. | Perovskite PV could be cost-effective alternative for wireless energy harvesting |
| 4.6.4. | Saule Technologies: Perovskite PV developer for indoor electronics |
| 4.6.5. | Energy harvesting from EM spectrum |
| 4.6.6. | Thermoelectrics as a power source for wearables |
| 4.6.7. | Flexible PV for energy harvesting: Readiness level assessment |
| 4.6.8. | Flexible PV for energy harvesting: SWOT analysis |
| 4.6.9. | Power sources for FHE roadmap by application sectors |
| 4.6.10. | Energy harvesting for FHE: Conclusions |
| 4.7. | Flexible substrates |
| 4.7.1. | Substrates for printed/flexible electronics: Introduction |
| 4.7.2. | Cost and maximum temperature are correlated |
| 4.7.3. | Properties of typical flexible substrates |
| 4.7.4. | Comparing stretchable substrates |
| 4.7.5. | Thermoset stretchable substrate used in multiple development projects |
| 4.7.6. | External debris and protection/cleaning strategies |
| 4.7.7. | Paper substrates: Advantages and disadvantages |
| 4.7.8. | Specialist paper substrates can have properties comparable to polymers |
| 4.7.9. | Sustainable RFID tags with antennae printed on paper |
| 4.7.10. | Dimensional stability: Importance and effect of environment |
| 4.7.11. | Manipulating polyester film microstructure for improved properties |
| 4.7.12. | Heat stabilization of polyester films |
| 4.7.13. | Roadmap for flexible substrate adoption |
| 4.7.14. | Flexible substrates for FHE: Conclusions |
| 4.8. | Conductive inks |
| 4.8.1. | Conductive inks: Introduction |
| 4.8.2. | Challenges of comparing conductive inks |
| 4.8.3. | Segmentation of conductive ink technologies |
| 4.8.4. | Conductive ink companies segmented by conductive material |
| 4.8.5. | Market evolution and new opportunities |
| 4.8.6. | Balancing differentiation and ease of adoption |
| 4.8.7. | Interest in novel conductive inks continues |
| 4.8.8. | Copper inks gaining traction but not yet widely deployed |
| 4.8.9. | Companies continue to develop and market stretchable/thermoformable materials |
| 4.8.10. | Higher nanoparticle ink prices offset by conductivity |
| 4.8.11. | Conductive inks: SWOT analysis |
| 4.8.12. | Conductive inks: Readiness level assessment |
| 4.8.13. | Conductive inks for FHE: Conclusions |
| 4.9. | Printing methods and R2R manufacturing |
| 4.9.1. | R2R manufacturing: Introduction |
| 4.9.2. | Can R2R manufacturing be used for high mix low volume (HMLV)? |
| 4.9.3. | What is the main commercial challenge for roll-to-roll manufacturing? |
| 4.9.4. | Examples of R2R pilot/production lines for electronics |
| 4.9.5. | Commercial printed pressure sensors production via R2R electronics |
| 4.9.6. | Emergence of a contract manufacturer for flexible hybrid electronics (FHE) |
| 4.9.7. | Applying 'Industry 4.0' to printed electronics with in-line monitoring |
| 4.9.8. | Applications of R2R electronics manufacturing |
| 4.9.9. | Comparison of printing methods: Resolution vs throughput |
| 4.9.10. | R2R manufacturing: SWOT analysis |
| 4.9.11. | R2R manufacturing: Readiness level |
| 4.9.12. | R2R manufacturing for FHE: Conclusions |
| 5. | USE CASES FOR FHE |
| 5.1. | Overview |
| 5.1.1. | Use cases for FHE |
| 5.1.2. | Technology gaps and potential solutions to meet application requirements |
| 5.2. | Electronic skin patches |
| 5.2.1. | Benefits of electronic skin patches as a form factor |
| 5.2.2. | Development from conventional boxed to flexible hybrid electronics to fully stretchable |
| 5.2.3. | Electronic skin patches within wearable technology progress |
| 5.2.4. | Skin patch applications overview |
| 5.2.5. | Interest in skin patches for continuous biometric monitoring continues |
| 5.2.6. | Material requirements for an electronic skin patch |
| 5.2.7. | Material suppliers collaboration has enabled large scale trials of wearable skin patches |
| 5.2.8. | Progress in using liquid metal alloys as stretchable inks for wearable electronics |
| 5.2.9. | Growing interest in liquid metal wiring for stretchable electronics (II) |
| 5.2.10. | 'Full-stack' material portfolios reduce adoption barriers |
| 5.2.11. | R2R pilot line production of skin patch with FHE. |
| 5.2.12. | Printed batteries in skin patches |
| 5.2.13. | Electronic skin patch manufacturing value chain |
| 5.2.14. | Electronic skin patch manufacturing process |
| 5.2.15. | Offering S2S and R2R production enables different order sizes |
| 5.2.16. | Increased demand for wearable/medical manufacturing leads to expansion plans |
| 5.2.17. | Utilizing existing screen-printing capabilities for electronic skin patches |
| 5.2.18. | GE Research: Manufacturing of disposable wearable vital signs monitoring devices |
| 5.2.19. | NextFlex: Utilizing electronics in silicone to make more comfortable skin patches |
| 5.2.20. | Key points: Materials for electronic skin patches |
| 5.2.21. | FHE for electronic skin patches: SWOT analysis |
| 5.2.22. | FHE for electronic skin patches: Conclusions |
| 5.3. | E-textiles |
| 5.3.1. | E-textiles can utilize FHE for component integration |
| 5.3.2. | E-textiles represent a small market share for biometric monitoring |
| 5.3.3. | Industry challenges for e-textiles |
| 5.3.4. | Three competing approaches to e-textile manufacturing |
| 5.3.5. | Conductive ink requirements for e-textiles |
| 5.3.6. | Permeability of particle-free inks enable direct metallization of fabric to form e-textiles |
| 5.3.7. | Embedding electronics in a box avoids washability issues |
| 5.3.8. | Patterning and design may be used to supplement capabilities of printed conductive inks |
| 5.3.9. | Comparing conductive inks in e-textiles |
| 5.3.10. | Challenges with conductive inks in e-textiles |
| 5.3.11. | Sensors used in smart clothing for biometrics |
| 5.3.12. | Electronic components are joined by connectors |
| 5.3.13. | Connector designs and implementations |
| 5.3.14. | Overview of components in e-textiles |
| 5.3.15. | Commercial progress with e-textile projects |
| 5.3.16. | FHE for e-textiles: SWOT analysis |
| 5.3.17. | FHE for e-textiles: Conclusions |
| 5.4. | Smart packaging |
| 5.4.1. | Smart packaging: An ideal candidate for FHE |
| 5.4.2. | Motivation for smart packaging: Logistics and safety |
| 5.4.3. | Motivation for smart packaging: Improving sales and consumer engagement |
| 5.4.4. | Current status of smart packaging market |
| 5.4.5. | RFID tags with printed silver antennas on paper substrates |
| 5.4.6. | Copper ink for RFID antennas offers reduced costs and improved sustainability? |
| 5.4.7. | FHE with printed batteries and antennas for smart packaging |
| 5.4.8. | Simpler FHE circuits achieve easier market traction |
| 5.4.9. | Established semiconductor manufacturer explores FHE circuits for smart packaging |
| 5.4.10. | Smart packaging requirements can be fulfilled with simpler, cheaper ICs. |
| 5.4.11. | FHE controls OLEDs for smart packaging |
| 5.4.12. | Smart-packaging to improve pharmaceutical compliance |
| 5.4.13. | Smart tags with a flexible silicon IC |
| 5.4.14. | 'Sensor-less' sensing of temperature and movement with |
| 5.4.15. | FHE for smart packaging: SWOT analysis |
| 5.4.16. | FHE for smart packaging: Conclusions |
| 5.5. | IoT devices (industrial and domestic) |
| 5.5.1. | IoT devices (industrial and domestic): An emerging opportunity for FHE, |
| 5.5.2. | Industrial asset tracking/monitoring with FHE |
| 5.5.3. | Integrating a flexible IC within a multimodal sensor array |
| 5.5.4. | Capacitive sensors integrated into floors and wall panels |
| 5.5.5. | Integrated electronics enable industrial monitoring |
| 5.5.6. | Multi-sensor wireless asset tracking system demonstrates FHE potential. |
| 5.5.7. | Passive UHF RFID sensors for structural health monitoring |
| 5.5.8. | FHE for IoT devices: SWOT analysis (I) |
| 5.5.9. | FHE for IoT devices (industrial and domestic): Conclusions |
| 5.6. | Lighting |
| 5.6.1. | FHE for large area lighting: Introduction |
| 5.6.2. | FHE contract manufacturer produces large area LED lighting |
| 5.6.3. | R2R etching competes with FHE |
| 5.6.4. | R2R manufactured LED lighting on foil |
| 5.6.5. | Directly printed LED lighting (I) |
| 5.6.6. | Directly printed LED lighting (II) |
| 5.6.7. | FHE for large area lighting: SWOT analysis |
| 5.6.8. | FHE for large area LED lighting: Conclusions |
| 5.7. | Prototyping |
| 5.7.1. | Additive circuit prototyping with FHE: An introduction |
| 5.7.2. | Additive circuit prototyping landscape |
| 5.7.3. | Prototyping flexible 2D circuits with additive electronics |
| 5.7.4. | Multilayer circuit prototyping |
| 5.7.5. | Affordable pick-and-place for prototyping and small volume manufacturing |
| 5.7.6. | Readiness level of additive circuit prototyping |
| 5.7.7. | Additive circuit prototyping with FHE: Conclusions |
| 6. | COMPANY PROFILES |
| 6.1. | American Semiconductor |
| 6.2. | ACI Materials |
| 6.3. | Alpha Assembly |
| 6.4. | BeFC |
| 6.5. | Boeing |
| 6.6. | Coatema |
| 6.7. | Copprint |
| 6.8. | CPI |
| 6.9. | DoMicro |
| 6.10. | DuPont |
| 6.11. | Elantas |
| 6.12. | Electroninks |
| 6.13. | GE Healthcare |
| 6.14. | Henkel |
| 6.15. | Heraeus |
| 6.16. | Holst Center |
| 6.17. | Indium |
| 6.18. | InnovationLab |
| 6.19. | Inuru |
| 6.20. | IOTech |
| 6.21. | Jabil |
| 6.22. | Laiier |
| 6.23. | Liquid Wire |
| 6.24. | Molex |
| 6.25. | Muhlbauer |
| 6.26. | Nano Dimension |
| 6.27. | NextFlex |
| 6.28. | Optomec |
| 6.29. | Panasonic Electronic Materials |
| 6.30. | PragmatIC |
| 6.31. | PrintCB |
| 6.32. | PVNanoCell |
| 6.33. | Safi-Tech |
| 6.34. | Saralon |
| 6.35. | Screentec |
| 6.36. | Sun Chemical |
| 6.37. | Sunray Scientific |
| 6.38. | TraXon |
| 6.39. | VTT |
| 6.40. | Wiliot |
| 6.41. | Ynvisible |
| 6.42. | Ynvisible/Evonik/EpishineContact IDTechEx |
Ordering Information
柔性混合电子元件 2024 - 2034
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电子版（1-5 名用户）
£5,650.00
电子版（6-10 名用户）
£8,050.00
电子版及 1 份硬拷贝文件（1-5 名用户）
£6,450.00
电子版及 1 份硬拷贝文件（6-10 名用户）
£8,850.00
电子版（1-5 名用户）
€6,400.00
电子版（6-10 名用户）
€9,100.00
电子版及 1 份硬拷贝文件（1-5 名用户）
€7,310.00
电子版及 1 份硬拷贝文件（6-10 名用户）
€10,010.00
电子版（1-5 名用户）
$7,000.00
电子版（6-10 名用户）
$10,000.00
电子版及 1 份硬拷贝文件（1-5 名用户）
$7,975.00
电子版及 1 份硬拷贝文件（6-10 名用户）
$10,975.00
电子版（1-5 名用户）
¥990,000
电子版（6-10 名用户）
¥1,406,000
电子版及 1 份硬拷贝文件（1-5 名用户）
¥1,140,000
电子版及 1 份硬拷贝文件（6-10 名用户）
¥1,556,000
电子版（1-5 名用户）
元50,000.00
电子版（6-10 名用户）
元72,000.00
电子版及 1 份硬拷贝文件（1-5 名用户）
元58,000.00
电子版及 1 份硬拷贝文件（6-10 名用户）
元80,000.00
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